CHO-BOND 1035 ONE COMPONENT ELECTRICALLY CONDUCTIVE SILICONE SEALANT

Артикул

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Бренд

Parker

Цена

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Описание

Краткое описание: Parker Chomerics CHO BOND® 1035 is a one-component, silver-plated glass filled sealant formulated to provide lightweight EMI shielding in commercial and military applications
Опции полимерных материалов: Silicone
Материал наполнителя: Silver-plated glass
Цвет: Beige
Объемное сопротивление: 0.05 Ω-cm
Прочность соединения внахлест при сдвиге: 689 kPa
Удельный вес: 1.9
Дюрометр: 81
Рабочая температура: -55 to 200 °C
Продолжительность работы: 0.5 hour
Срок хранения: 6 Months
Толщина пленки: 0.18 to 3.18 mm
Тип упаковки: 1.5 fluid ounce aluminum foil tube , 6 fluid ounce SEMCO cartridge
Customer Value Proposition:

CHO-BOND® 1035 is a silver-plated glass filled, onecomponent conductive silicone designed for use as a fillet, gap filler and seam sealant for electrical enclosures where EMI shielding or electrical grounding is required. Minimum recommended bond line for CHO-BOND 1035 is 0.007 inches (0.18 mm). The lightweight silver glass filler of CHO-BOND 1035 provides a low cost EMI shielding solution for a variety of commercial and military applications including applications where weight savings are critical. CHO-BOND 1035’s moisture cure silicone polymer system allows it to cure to the touch in 24 hours and provides a flexible, conductive and environmental seal over a wide range of application temperatures.

For best adhesion results, CHO-BOND 1035 should be used in conjunction with CHO-SHIELD 1086 primer. Typical applications include man portable electronics, radar and communication systems, EMI vents, military ground vehicles, and shelters. However, due to its spherical shaped silver plated glass filler, CHO-BOND 1035 is not recommended for equipment or applications where the material will experience vibration.

Features and Benefits:
• One component
• Easy to use, no weighing or mixing required.
• Silver plated glass filler
• Good Conductivity 0.050 ohm -cm Low cost ($/cc).
• Moisture cure silicone
• 30 minute working life, rapid skin formation, 24 hr handling time, requires no pressure during curing, wide range of application temperatures. 1 week for full cure.
• Light weight
• More coverage per gram of material, minimal weight added to assembly or vehicle.
• Non corrosive cure mechanism
• No corrosive by-products generated during curing to damage substrate.
• Thin paste • Very easy to dispense, apply and spread.