CHO-SHIELD 2056 ELECTRICALLY CONDUCTIVE SILVER-PLATED COPPER ACRYLIC EMI COATING

Артикул

-

Бренд

Parker

Цена

-

Описание

Краткое описание: Parker Chomerics CHO-SHIELD® 2056 EMI coating is a one-component, silver and silver-plated copper filled acrylic paint designed for high levels of EMI shielding on plastic substrates
Тип упаковки: 1 gallon aluminum can
В комплект входит грунтовка: Not required
Опции полимерных материалов: Acrylic
Материал наполнителя: Pure Silver
Цвет: Copper
Вязкость материала, наносимого распылением, и метод испытаний: 14 to 20 seconds Zahn Cup 2
Уровень экранирования от шума: >75 dB
Толщина пленки: 0.025 mm
Удельный вес: 1.13
Процентное содержание твердых веществ по массе: 32 %
Рабочая температура: -40 to 85 °C
Срок хранения: 12 Months
Customer Value Proposition:

CHO-SHIELD® 2056 is an electrically conductive,
one-component silver and silver/
copper-filled acrylic coating that is specially
formulated for application on plastics to
provide high levels of EMI shielding.
CHO-SHIELD 2056 is ideal for use on medical
electronic enclosures and assemblies
which require high level, reliable EMI shielding
performance and may benefit from silvers’
antimicrobial properties. The excellent
electrical conductivity of the coating allows
for thinner applied coatings, saving time and
money in processing. Thinner coatings limit
material wastage due to overspray and reduce
the frequency of mask washing steps.

Meets UL Specification 746-C for adhesion.

CHO-SHIELD 2056 conductive coating is
ideal for a variety of applications, including:

• High levels of EMI shielding (see
shielding effectiveness curve Fig. 1)
• Anti-static protection
• Surface grounding
• Coating of ABS, PC/ABS, and many other
types of plastic enclosures


Features and Benefits:
• One component
• Easy to use. CHO-SHIELD 2056 is ready to
use with simple mixing. Can be applied with
standard spray paint equipment, no expensive
capital equipment required.
• Thermoplastic acrylic
• Material dries at room temperature-no high
temperature cure ovens required, fast
throughput. Good adhesion to a variety of plastics.
• Silver/copper and silver flake filler
• Excellent conductivity and EMI shielding. Cost-
effective solution for electronic enclosures and
assemblies which require high level EMI shielding and conductivity.
• Excellent-leveling, Wets and covers surfaces smoothly
• Provides great coverage at thin dry film
thickness which minimizes material costs
and reduces paint cycle time.


Application
Recommended Preparation

1. Clean the substrate:
The substrate surface should be clean,
dry and free of oils, release agents, dirt
and lint.
2. Mix the material:
Mix the material well on a paint shaker
(typically 1-minute for one-gallon can).
Or, mix by hand with a large spatula
until all solids are in a homogeneous
suspension. Check that no unmixed
material remains on the bottom and
the sides of the container.
3. Optional: Strain the material
to reduce or eliminate the potential
for clogging the spray nozzle. The
paint can be strained through a course
mesh (1000 micron) flat strainer into a
pressure pot for spray. All metal fillers
should be transferred, although a small
amount of filler clusters might be collected
in the strainer.


Optional thinning:

Standard thinning can be accomplished
with MEK (methyl ethyl ketone) solvent.
During humid days (relative humidity
>50% and temperature >30°C/85°F),
use n-Butyl alcohol and add up to
8 fluid ounces per gallon of paint to
eliminate blushing (a white tint on the
drying surface).


Fluid Delivery System

Use a pressure pot (15 psi, 103 kPa,
typical) with large diameter, paddletype
agitator at low mixing speed to
keep the metal fillers in uniform suspension.

Conventional spray equipment such as
HVLP (High Volume, Low Pressure) or
DeVilbiss EGA 503 with propeller agitator
pressure pots may be used for spray
application with approximately 20-50
psi (138-345 kPa) atomizing air. Use
lowest pressure possible.
Re-circulation of the paint from the
mixing pot through the spray gun and
back via a pump delivery system is recommended
for greater filler uniformity.
For large volume applications, a robotic
spray system with an HLVP spray gun
should be used to minimize material loss
due to overspray and maximize paint
transfer efficiency. Siphon feed equipment
can be used for small or prototype
runs.


Spray Gun and Pressure

Use a standard HVLP spray gun with
approximately 20-40 psi (138-276 kPa)
atomizing air.

A fluid nozzle with a minimum orifice diameter
of 0.040 (1.016) is recommended.
To obtain maximum adhesion and conductivity,
dry spraying should be avoided.
Adjust the spray pressure to achieve a
proper wet film when applying the conductive
coating.


Nominal Dry Film Thickness

A nominal dry film thickness of 0.001
inches (25 µm, 1 mil) is recommended
to obtain > 75 dB shielding effectiveness
from 80 MHz to 18 GHz. However, a thinner
or thicker coat may be acceptable
depending on the shielding requirements
of the device being protected.
Allow material to dry 10-20 minutes at
room temperature between coats to
avoid solvent entrapment.


Drying Conditions

1. Dry at room temperature for
10-20 minutes.
2. Continue drying for 30 minutes at
65°C ± 5.5°C (150°F ± 10°F)
for 0.001 inches (25 µm, 1 mil)
thickness.

Dry longer if thicker film, shorter if
thinner film, to achieve desired
conductivity.
Note: Drying at room temperature
for 24 hours will achieve similar
performance.


Clean-up

The spray system, including spray
gun, mixing pot, and containers can
be cleaned with MEK or Acetone (VOC
exempt solvent). Masks can be powerwashed
with Challenge 485S barrier
coat.


Storage and Handling

CHO-SHIELD 2056 should be stored
at 10ºC to 30ºC (50ºF to 86ºF) and has
a 12 month shelf life from the date of
manufacturing in the original sealed
container. CHO-SHIELD 2056 is a
flammable liquid. Please consult the
material safety data sheet for proper
handling procedures before use.