CHO-SHIELD 571 HIGHLY CONDUCTIVE SILVER EPOXY EMI COATING FOR SEMICONDUCTOR PACKAGES

Артикул

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Бренд

Parker

Цена

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Описание

Краткое описание: Parker Chomerics CHO-SHIELD® 571 is a highly conductive, advanced coating developed for high volume, precise spray application on circuit boards and semiconductor packages.
Опции полимерных материалов: Epoxy
Материал наполнителя: Silver
Тип упаковки: 2 component kitA: 1 pint aluminum canB: 4 fluid ounce amber bottle
В комплект входит грунтовка: Not required
Коэффициент: 100:8.3 by weight
Цвет: Silver
Вязкость материала, наносимого распылением, и метод испытаний: 19 to 25 seconds Zahn Cup 2
Уровень экранирования от шума: >100 dB
Толщина пленки: 0.025 mm
Удельный вес: 1.39
Рабочая температура: -40 to 125 °C
Срок хранения: 9 Months
CHO-SHIELD®
571 is a highly conductive,
advanced coating developed for high volume,
precise spray application on circuit boards
and semiconductor packages . Combined
with innovative technologies and packaging
designs, CHO-SHIELD 571 can provide
board level or package level EMI shielding of
electrical components.

Applied correctly, CHO-SHIELD 571 can
replace stamped metal cans, saving valuable
board space and reducing the overall cost
of board level EMI shielding. CHO-SHIELD
571’s polymer system has been custom
formulated to closely match the coefficient
of thermal expansion (CTE) of typical epoxy
molding compounds resulting in great
adhesion and environmental stability of the
coating on semiconductor devices.


Features and Benefits:
• Two component • Designed for high volume spray application.
Minimum 12 hour working life at room temperature.
• Silver flake filler • Excellent conductivity and EMI shielding of components.
• Epoxy coating
• Good adhesion to semiconductor packaging materials due to CTE (coefficient of thermal expansion) match of polymer. Environmentally stable, Heat (100 hrs @ 150°C (302°F), Humidity 85% R.H.), Thermal-cycling [85°C (185°F)/85% R.H.] Withstands wave solder temperatures in excess of 262°C (500°F).