ParPHorm S1945 Form-In-Place Sealing Compound OBSOLETE

Артикул

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Бренд

Parker

Цена

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Описание

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Тип упаковки: 12 fl. oz. SEMCO Tube
Дюрометр: 25
Предел прочности на разрыв: 1.91
Тип продукта: Thermal Cure
Удельный вес: 0.78
Материал корпуса: Silicone
Срок хранения: 6 Months
Материал наполнителя: None
Опции полимерных материалов: Silicone
ParPHorm is a family of non-conductive, thermal and mois- ture cure, form-in-place, elastomeric sealing compounds. These silicone and fluorosilicone materials provide environ- mental, fluid, and dust sealing of small enclosures. The prod- uct line consists of state-of-the art compounds designed to be robotically dispensed onto small housings and then cured. Curing of the dispensed materials is done via in-line ovens at 284o F (140o C) for 30 minutes. Dispensed bead heights range from 0.018 in. (0.46 mm) to 0.062 in. (1.57 mm). Application advantages of the materials are resistance to a wide variety of fluids, excellent substrate adhesion, low hardness, and outstanding compression set properties.

ParPHorm S1945 is a silicone FIP material with lower hard- ness (Shore A 25) and excellent compression set (21%).
ParPHorm S1945 is especially designed for low closure force applications and those requiring exceptional adhesion
properties. Due to its minimal hardness, S1945, is one of the most widely used ParPHorm materials and thus has exten- sive application in many areas. The compound adheres well to aluminum, phenolic resins, copper, stainless steel, glass, rigid PVC, most ceramics, and various plastics. ParPHorm S1945 is compatible with air below 400o F, ethylene glycol, nitrogen, sea (salt) water, magnesium sulfite and sulfate, citric acid, methanol, ozone, soap solutions, zinc salts and zinc sulfates, potassium chloride/nitrate, barium chloride/ hydroxide/salts, sodium chloride/salts/sulfates, and glycols.