T670 High-Performance 3.0 W/m-K Thermal Grease for Thin Bond Lines (0.001")

Артикул

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Бренд

Parker

Цена

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Описание

Краткое описание: Parker Chomerics T670 Thermal Grease is a high performance (3.0 W/m-k thermal conductivity) grease ideal for thin bond line applications.
Тип упаковки: 8 ounce container, 1 gallon pail
Цвет: White
Удельный вес: 2.6
Динамическая вязкость: 350000 cP
Рабочая температура: -50 to 200 °C
Теплопроводность: 3 W/m-K
Тепловое сопротивление: 0.07 @ 50°C, 0.07 @ 65°C °C-cm2/W
Теплоемкость: 1 J/g-K
Коэффициент теплового расширения: 150 ppm/K
Объемное сопротивление: 10^14 Ω-cm
Общая потеря массы вследствие выделения газов: RoHS %
Срок хранения: 12 Months
Description
Chomerics thermal greases offer a range of performance covering the simplest to the most demanding thermal requirements. These materials are screened, stenciled or dispensed and require virtually no compressive force to conform under typical assembly pressures. The excellent surface wetting results in low interfacial resistance.

• T670 is offered with a very high bulk thermal conductivity of 3 W/m-K. Product offers low impedance as it will achieve a thin bondline of about 0.001 in.

Features/Benefits
• Silicone based materials conduct heat between a hot component and a heat sink or enclosure
• Fills interface variable tolerances in electronics assemblies and heat sink applications
• Dispensable, highly conformable materials require no cure cycle, mixing or refrigeration
• Thermally stable and require virtually no compressive force to deform under typical assembly pressures
• Supports high power applications requiring material with minimum bond line thickness and high conductivity
• Ideal for rework and field repair situations